Core Business

Our highly experienced team brings to you program management from inception to delivery. We ensure our customer's time-to-market needs, with support that includes:

• Application Engineering services
• Circuit design and layout routing
• Manufacturing of prototype sample
• Manufacturing of high volume production parts
• Turnkey component assembly service

Click here for the details:
- FPC Applications
- Manufacturing Facilities
- R&D Capabilities

FPC Applications

List of some FPC Applications:

Manufacturing Facilities

Products

We have the manufacturing capability to produce a wide range of FPCs with customised features to meet our customers' needs for responsive, flexible services and short lead-time.

Materials

We continue to build on our relationship with our key suppliers for competitive materials pricings. We had implemented supply chain management programme to manage inventory and to reduce production cycle time.

Process Types

We are investing in various new process that can be used in a wide variety of products such as mobile phones, personal digital assistants, notebooks, personal computers, hard disks and tape drives, two way radios, battery packs and medical aids

Process Capabilities

We have been investing in latest equipment to automate our manufacturing process to meet higher standards in products reliability and increased consistency in quality.

R & D Capabilities

We recognise the importance of R & D capabilities and therefore place emphasis on continuous improvement on process capabilities, product development and technological advancement.

Mission

To lead MFS into the future through the development and implementation of new technologies and products which are customer-focused and application-centre.

New Developments

Background Information On FPCs And Rigid PCBs

Interconnect substrates are used to provide the electrical connection between components in electronic systems and as a substrate to support electronic devices. Such interconnect substrates include FPCs, rigid PCBs and ceramic hybrid circuits. FPCs and rigid PCBs are fundamental and generic commodities common to all electronic products.

Unlike a rigid PCB which is normally constructed out of copper clad epoxy glass laminate sheets, a FPC is constructed from a flexible polyimide plastic dielectric using an acrylic or epoxy adhesive to bond the dielectric to metal conductors, typically copper, or to other sections of dielectric as required.

In general, FPCs are employed when there is a need to bend or flex an interconnect for use in products such as cellular phones and storage devices. Rigid PCBs are typically less expensive and are employed in flat plane applications.

Over the past decade, electronic systems, particularly portable computers and computer peripherals, telecommunications and consumer electronic products, have seen demands for increase in product functionality and significant reductions in size, weight and price.
This trend towards miniaturisation has increased end user demand for these products. In producing these products, electronic systems manufacturers are driven to reduce their costs in order to remain competitive. System manufacturers would have to rely on more complex and higher density rigid PCBs which can accommodate more circuitry in a smaller space.

In this regard, FPCs offer several advantages over the rigid PCBs, particularly for smaller complex electronic systems, by reducing the need for connectors, cables and other packaging components. Further, FPCs can conform to contoured ergonomic shapes or small spaces, provide mechanical flexure, vibratory stability, enhanced connectivity and offer superior thermal dissipation characteristics. These capabilities enable FPCs to reduce the overall assembly cost for system manufacturers as compared with traditional interconnection devices.

The advancement of PCB technology such as the development of high density PCBs has broadened its use in the application of electronic products/components like telecommunications, industrial equipment and instruments, automotive as well as in high precision instruments used in photography, chronometers, healthcare and avionics amongst others.

The range of applications for both rigid PCBs and FPCs is diverse, covering disk drives and other storage systems, cellular phones, consumer electronic products, medical instruments, automotive parts, military and aerospace systems.